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About ASE Material
     
     
  ASE Material provides the design and production of interconnect materials, such as substrates, used in the packaging of semiconductors. With a commitment to applying innovative technology to lower excessive substrate costs, ASE Material delivers competitive cost and performance advantages to integrated device manufacturers (IDMs) and fabless chip companies worldwide.

Recognizing the need for a reliable material supplier, ASE Material was established in 1995 in Kaohsiung, Taiwan where operations began with the development of etched leadframes. Three years later, ASE Material entered the laminate substrate market and has since grown to become the largest PBGA substrate supplier in the industry (Prismark March 2005). In 2003, ASE Material began high-volume production of flip chip build-up substrates at its state-of-the-art facility in Chung-Li, Taiwan.

The company is focused on the research and development of advanced substrate technology for lower cost, higher performance, and environmentally compatible IC package solutions. By applying leading-edge technology, ASE Material delivers significant economic and performance advantages to the foremost semiconductor companies worldwide.

Interconnect material cost is now the biggest component in the total cost of a package.  The integration of material operations into the ASE value chain greatly enhances our value proposition for customers. By expanding our material manufacturing capacity, ASE provides a more attractive cost solution for our customers.


Note:
ASE Group is the only semiconductor back-end manufacturing company that owns and operates its own materials division. Although it is a wholly-owned subsidiary of the ASE Group, ASE Material operates as a completely independent business unit within the group.

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