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Applications Overview
     
     
 

With an expansive substrate portfolio, ASE Material enables our customers to select the materials that best meets their device and budget requirements. From flip chip to wire bond substrates, ASE Material combines the technology, the technical support, and the world-class customer service that give customers the competitive advantage they need to lead the industry.

Our customers can select the ASE Material substrate built to meet the specific needs of graphics, chipsets, application-specific integrated circuits (ASICs), and system-on-chip (SoC) devices as well as ICs for consumer, communications and computing applications.

Our market understanding, complemented by our broad product portfolio, make ASE Material an ideal choice for integrated device manufacturers (IDMs) and fabless semiconductor companies worldwide as they seek to address their semiconductor packaging material needs.

ASE Material is ISO-9002 Certified, ISO-14001 Certified, QS-9000 Certified, and TS 16949 Certified.

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