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Flip Chip Substrates
  The technology known as flip chip derived its name from the method of flipping over a chip to connect directly with the substrate or leadframe. Unlike traditional interconnection techniques using wire bonding, flip chip interconnection is achieved through solder or gold bumps. Consequently, I/O pads are not limited to the peripheral region, but can be distributed over the entire surface of the chip. This means that the chip size can be decreased and the circuit path optimized, while the absence of bonding wire significantly reduces signal inductance.

Flip chip technology is increasingly being adopted due to:

  • Shorter assembly cycle time – Bonding for flip chip packages is completed in one process.
  • Higher signal density & smaller die size - Area array pad layout increases I/O density, while based on the same number of I/Os, the actual size of the die can be significantly reduced.
  • Good electrical performance - Shorter path between die and substrate improves the electrical performance.
  • Direct thermal dissipation path – An external heat sink can be directly added to the chip to remove the heat.
  • Lower packaging profile - Absence of wire and molding allows flip chip packages to feature lower profiles.