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Flip Chip BGA
     
     
 


Product Overview

Flip Chip Organic BGA
Organic BGA Laminate or build-up organic substrate offers better electrical performance than wire-bond BGA packages, especially in high frequency applications.


Applications

Computers: Graphics/chipsets for PC, Server and High-end applications, Microprocessors for PC & Server, and Memory.
Telecommunications: Network products (LAN), Switching, Transmission, and Cellular Base Stations.

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Features

Small size
Smaller IC footprint, reduced height, and weight.

Improved performance
Short interconnect delivers low inductance, resistance and capacitance, small electrical delays, good high frequency characteristics.

Increased functionality
The use of flip chips allows an increase in the number of I/Os. An area array pad layout enables more signal, power, and ground connections in less space.

Low cost
Cost of bumping decreases, as well as cost reductions in the underfill-process.

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Reliability

Package Level

Pass
Cutomer Structure Body Size Die Size Pre-con PCT TCT HAST HTST THT
ChipSet 2+2+2 37.5*37.5 9.5*9.5 125~-55°C N/A 125~-55°C 130°C/
85%RH
150°C N/A
Pass 1000X 100hrs 1000hrs
Test
Vehicle
2+2+2 40*40 15.3*15.3 125~-65°C 121°C/
100%RH
125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
Pass 96hrs 1000X 100hrs 1000hrs 1000hrs
Graphic 2+2+2 40*40 14.5*14.5 150~-55°C 121°C/
100%RH
125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
Pass 96hrs 1000X 100hrs 1000hrs 1000hrs
Graphic 2+2+2 40*40 14.5*14.5 125~-55°C N/A 125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
220°C
Reflow Pass
1000X 100hrs 1000hrs 1000hrs
Graphic 2+2+2 40*40 14.5*14.5 125~-55°C N/A 125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
260°C
Reflow Pass
1000X 100hrs 1000hrs 1000hrs
Graphic 2+2+2 31*31 9.7*9.8 125~-55°C N/A 125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
220°C
Reflow Pass
1000X 100hrs 1000hrs 1000hrs
Graphic 2+2+2 31*31 9.7*9.8 125~-55°C N/A 125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
260°C
Reflow Pass
1000X 100hrs 1000hrs 1000hrs
Graphic 2+2+2 40*40 14.5*14.5 125~-55°C N/A 125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
Pass 1000X 100hrs 1000hrs 100hrs
Graphic 3+2+3 31*31 10.92*10.85 125~-55°C N/A 125~-40°C 130°C/
85%RH
150°C N/A
Pass 1000X 100hrs 1000hrs
Graphic 2+2+2 35*35 12*12 125~-55°C N/A 125~-55°C 130°C/
85%RH
N/A N/A
Pass 1000X 168hrs
ASIC 1+2+1 35*35 9.93*6.17 150~-65°C 121°C/
100%RH
150~-65°C 130°C/
100%RH
150°C N/A
Pass 300X 500X 96hrs 1000hrs

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Pass
Cutomer Structure Body Size Die Size Pre-con PCT TCT HAST HTST THT
Graphic 2+2+2 37.5*37.5 14.86*14.86 150~-55°C N/A 125~-55°C 130°C/
100%RH
150°C N/A
Pass 1000X 168hrs finish.
2/45 open due to crack between UBM & solder ball
1000hrs
Graphic 2+2+2 37.5*37.5 14.86*14.86 150~-65°C N/A 125~-55°C 130°C/
100%RH
150°C N/A
Pass 1000X on
going 1/45
open Metal
layer peeling
168hrs 1000hrs
ASIC 2+2+2 35*35 7.55*7.55 150~-65°C N/A 125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
Pass 500X 96hrs 1000hrs 1000hrs
Graphic 2+2+2 31*31 9.7*9.8 125~-55°C N/A 150~-65°C 130°C/
85%RH
N/A 85°C/
85%RH
192hrs Pass 500X,1/45
open due to
bump crack
1000X,2/44 open due to bump crack
100hrs,1/45 open due to
bump crack
200hrs,6/39 open due to bump crack
1000hrs
2+2+2 31*31 9.7*9.8 125~-55°C N/A 125~-55°C 130°C/
85%RH
N/A 85°C/
85%RH
96hrs Pass 300X,1/45
open due to bump crack 1000X,1/44
open hypothsis same defent mode a TCT & HAST FA result
200hrs 1000hrs
CSP 2L 13*13 7.7*7.7 150~-65°C
220°C
N/A 125~-55°C 130°C/
100%RH
   
Pass 500X,11/22
die discolor
1000X stop
96hrs,22/22
die discolor
168hrs stop
ASIC 1+2+1 15*15 7.7*5.4 150~-65°C
220°C
N/A 125~-55°C 130°C/
100%RH
150°C 85°C/
85%RH
Pass 500X 96hrs 1000hrs 1000hrs

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Pass
Cutomer Structure Body Size Die Size Pre-con PCT TCT HAST HTST THT
ASIC 2+2+2 35*35 7.55*7.55 150~-65°C
220°C
N/A 125~-55°C 130°C/
100%RH
150°C 85°C/
85%RH
Pass 500X 96hrs 1000hrs 1000hrs
150~-65°C
220°C
N/A 125~-55°C 130°C/
100%RH
150°C 85°C/
85%RH
Pass 500X 96hrs 1000hrs 1000hrs
150~-65°C N/A 125~-55°C 130°C/
100%RH
150°C 85°C/
85%RH
Pass 500X 96hrs 1000hrs 1000hrs
CSP 2+2+2 31*31 15.96*16.04 150~-65°C N/A 125~-55°C 130°C/
100%RH
N/A N/A
Pass 1000X 168hrs
Graphic 2+2+2 31*31 9.14*9.14 125~-55°C N/A 125~-55°C 130°C/
85%RH
150°C 85°C/
85%RH
1/151 open due tj missing pre-solder 1000X 100hrs 1000hrs 1000hrs
Graphic 2+2+2 40*40   125~-55°C N/A 125~-55°C 130°C/
85%RH
N/A N/A
10151 short due to die short 1000X 100hrs
CPU 2+2+2 37.5*37.5 6.45*8.66 150~-65°C N/A 125~-55°C 130°C/
85%RH
N/A N/A
Pass 1000X 96hrs, T/S fail due to die delam.
Graphic 2+2+2 33*33 12.8*12.96 L5 125~-55°C N/A N/A 130°C/
85%RH
N/A N/A
Pass 100hrs
Graphic 2+2+2 31*31 9.49*8.7 L5 125~-55°C N/A N/A 130°C/
85%RH
N/A N/A
Pass 100hrs
Graphic 2+2+2 31*35   125~-55°C N/A 125~-55°C 130°C/
100%RH
150°C 85°C/
85%RH
Pass 1000X 100hrs 1000hrs 500hrs

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