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BGA Stubless - GPP
     
     
 


Product Overview

GPP refers to Gold Plating Process, meaning that the Ni/Au plating process has been applied to all trace and finger patterns.


Applications

ASE BGA's design and features improve the performance of graphic ICs, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages.

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Features

What is so unique about the GPP design is that it has no plating bus, which results in the following:
• Better electrical performance in high-frequency.
• Higher density in substrate pattern design.
• Open/Short Test can be applied in substrate suppliers for matrix substrate type.

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Reliability

Package Level

Regular
BOM
(240°C)
MSL JEDEC Level 3, 30°C/60% RH 192 hours
PCT 121°C/100%RH/15  psig  
TCT -65°C~150°C 100 cycles
HAST 130°C/85%RH/33.5 psig 96 hours
HTST 150°C 1000 hours

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