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PBGA
     
     
 


Product Overview

PBGA (Plastic Ball Grid Array) substrate provides the interconnection platform with the circuit board for assembly package. It protects and supports ICs through thermal enhancement.


Applications

The design and advanced features of ASE's PBGAs improve the performance of graphic ICs, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays, and memory packages.

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Features

PBGA is suitable for high power and high speed ICs, requiring superb electrical and thermal enhancement.
• 15x15 mm to 45x45 mm package
• 119 balls to 1520 ball count
• High interconnect density
• Low assembly cost
• Ease of thermal and electrical management
• Ease of routing
• Good power dissipation
• Lead free /Halogen free available
• Full in-house design capability
• Fine pitch design capability
• Stub-less design capability
• Build up structure capability

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Reliability

Package Level

Regular
BOM
(240°C)
MSL JEDEC Level 3, 30°C/60% RH 192 hours
PCT 121°C/100%RH/15 psig
TCT -65°C~150°C 100 cycles
HAST 130°C/85%RH/33.5 psig 96 hours
HTST 150°C 1000 hours
Lead Free
BOM
(260°C)
MSL JEDEC Level 3, 30°C/60% RH 192 hours
TCT -65°C~150°C 100 cycles
HAST 130°C/85%RH/33.5 psig 96 hours
HTST 150°C 1000 hours
Lead Free
BOM
(260°C)
MSL JEDEC Level 2, 85°C/60% RH 168 hours
TCT -65°C~150°C 100 cycles
HAST 130°C/85%RH/33.5 psig 96 hours
HTST 150°C 1000 hours

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Stand Materials

Category Item Available Solution
Material Core /LeadFree BT HL832,  HL832HS
Core Halogen Free HL832NB , HL832NX, E679FGB(for 2L)
Solder Mask AUS 5
Solder Mask /Lead Free AUS 5 ,AUS303
Solder Mask /Halogen Free AUS 308
Solder Mask /High Reliability Remark

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